Product Details
Product Overview
KJ-930 High-Temperature Putty Adhesive is specifically developed for high-temperature infusion molding in industries such as aerospace and other composite material manufacturing. Made through advanced processes, it is suitable for high-temperature applications. Upon heating, the product becomes sticky and cures through vulcanization, capable of operating at temperatures up to 300°C, with a short-term maximum temperature resistance of up to 330°C. Additionally, it has excellent sealing properties during the curing cycle, and after curing, it can be easily stripped from the mold surface without leaving any residue.
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